![]() Original Assignee BEIJING ACUTI MICROSYSTEMS Co Ltd Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.) ( en Inventor 杨少军 Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.) Granted Application number CN2010101441501A Other languages Chinese ( zh) Google Patents Silicon microphone packaging method capable of shielding electromagnetic interference, packaging body and electronic deviceĭownload PDF Info Publication number CN102215448A CN102215448A CN2010101441501A CN201010144150A CN102215448A CN 102215448 A CN102215448 A CN 102215448A CN 2010101441501 A CN2010101441501 A CN 2010101441501A CN 201010144150 A CN201010144150 A CN 201010144150A CN 102215448 A CN102215448 A CN 102215448A Authority CN China Prior art keywords silicon microphone chip substrate holding wire integrated circuit Prior art date Legal status (The legal status is an assumption and is not a legal conclusion. Google Patents CN102215448A - Silicon microphone packaging method capable of shielding electromagnetic interference, packaging body and electronic device CN102215448A - Silicon microphone packaging method capable of shielding electromagnetic interference, packaging body and electronic device ![]()
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